Azur System (Shanghai) Fluid Technology Co., Ltd.+86 139 1844 2892 / sales@auzrsystem.comFiltration · Separation · Purification

SEMICONDUCTOR

Thin-Film Processes

Manage particles and connection cleanliness across deposition gas delivery, purge and chamber venting.

Process & filtration objectives

Filtration in vapor deposition primarily concerns particles in gas delivery, purge lines and chamber venting. PVD, CVD and related thin-film processes use different fluid conditions; a gas retention rating is not a liquid pore rating.

Gas particle filtration differs from purification of moisture, oxygen or molecular contaminants. Selection begins with gas identity, flow reference conditions, pressure and connections, then evaluates the filter within the complete gas distribution design.

Typical process pathway

  1. 01

    Gas intake

    Identify the actual gas and supply changes, documenting regulation and switching points and the particle-control boundary.

  2. 02

    Distribution

    Consider particles generated downstream of valves and connections, alongside clean assembly requirements for the gas path.

  3. 03

    Tool supply

    Assess pressure loss and response against tool demand, distinguishing continuous supply from short flow changes.

  4. 04

    Purge and vent

    Analyze purge and chamber-filling paths separately rather than treating different gas duties as identical conditions.

This is a typical task pathway. Confirm sequence, equipment and operating conditions for the project.

Filtration points & selection rationale

Process pointFiltration taskSelection rationale
Tool gas inletManage particles introduced during deliveryReview gas compatibility and pressure conditions for the complete assembly.
Purge branchControl particles in auxiliary gasConsider connection type, cleanliness and intermittent operation.
Chamber vent lineControl particles introduced during fillingConsider changing flow and downstream chamber requirements together.

Verification & operating records

Evaluation itemRecording & comparison
Gas pressure lossRecord gas, temperature, inlet pressure and flow reference conditions; distinguish actual from standard volumetric flow.
Connection integrityLink leak checks, installation and maintenance records to the actual assembly using equipment-approved methods.
Cleanliness trendsRelate particle observations to chamber maintenance, filter replacement and gas-source changes.

Application questions

Can a particle filter replace a gas purifier?

No. Particle capture does not establish removal of moisture, oxygen or volatile species. Adsorptive purification requires a separate assessment.

Does this also cover liquid coating?

Liquid coating requires assessment of solvent, viscosity and gels. Gas-path selection for vapor deposition cannot be transferred directly to coating liquids.

Related product pathways

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This page outlines general application considerations. Confirm product suitability against actual operating conditions and technical documentation.

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